Invention Grant
- Patent Title: Methods for compressing and decompressing texture tiles and apparatuses using the same
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Application No.: US17160556Application Date: 2021-01-28
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Publication No.: US11425403B2Publication Date: 2022-08-23
- Inventor: Yemao Shen , Deming Gu , Heng Que , Wei Zhang
- Applicant: VIA Alliance Semiconductor Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: VIA Alliance Semiconductor Co., Ltd.
- Current Assignee: VIA Alliance Semiconductor Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: McClure, Qualey & Rodack, LLP
- Priority: CN201611033694.4 20161118
- Main IPC: H04N19/426
- IPC: H04N19/426 ; G06T7/90 ; H04N19/593 ; G06T9/00 ; H04N19/136 ; H04N19/65
Abstract:
The invention introduces a method for compressing texture tiles, which contains at least the following steps: lossless-compressing raw data of a texture tile; determining whether a length of the lossless-compression result of the raw data is greater than a target result; and when the length of the lossless-compression result of the raw data is greater than the target length, performing data-reduction control in layers for generating reduced data by reducing the raw data, and generating a lossless-compression result of the reduced data, thereby enabling the length of the lossless-compression result of the reduced data to be equal to the target length or shorter.
Public/Granted literature
- US20210152838A1 METHODS FOR COMPRESSING AND DECOMPRESSING TEXTURE TILES AND APPARATUSES USING THE SAME Public/Granted day:2021-05-20
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