Invention Grant
- Patent Title: Expandable intervertebral implant, system, kit and method
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Application No.: US14640264Application Date: 2015-03-06
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Publication No.: US11426290B2Publication Date: 2022-08-30
- Inventor: William Miller
- Applicant: DePuy Synthes Products, Inc.
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agency: BakerHostetler
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/30

Abstract:
An implant includes a first plate and a second plate, a first wedge member and a second wedge member spaced from the first wedge member that couple the first and second plates together. The first and second wedge members configured to translate along the first and second plates from a first contracted configuration into a second expanded configuration. The implant includes an actuation member coupled to the first wedge member and the second wedge member. The actuating member defines a flange extending toward the first and second plates. The actuation member configured to move the first and second wedge members from the first contracted configuration into the second expanded configuration so that the first and second plates separate from each other.
Public/Granted literature
- US20160256291A1 EXPANDABLE INTERVERTEBRAL IMPLANT, SYSTEM, KIT AND METHOD Public/Granted day:2016-09-08
Information query
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