Invention Grant
- Patent Title: Wafer supporting mechanism, chemical vapor deposition apparatus, and epitaxial wafer manufacturing method
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Application No.: US16063391Application Date: 2016-12-12
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Publication No.: US11427929B2Publication Date: 2022-08-30
- Inventor: Jia Yu , Naoto Ishibashi , Keisuke Fukada , Tomoya Utashiro , Hironori Atsumi
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2015-249024 20151221
- International Application: PCT/JP2016/086898 WO 20161212
- International Announcement: WO2017/110552 WO 20170629
- Main IPC: C30B25/12
- IPC: C30B25/12 ; C23C16/458 ; H01L21/677 ; H01L21/687 ; H01L21/31 ; H01L21/205 ; C23C16/44 ; H01L21/673 ; C30B25/10 ; C30B25/14

Abstract:
A wafer supporting mechanism including: a wafer supporting table; and a movable part supported by the wafer supporting table, wherein the wafer supporting table includes a wafer supporting portion for transfer that stands up from a first surface opposing a back surface of a wafer to be placed and is provided further toward an inner side than an outer peripheral edge of the wafer to be placed, and the movable part includes a wafer supporting portion for film formation that is positioned further toward an outer peripheral side of the wafer to be placed than the wafer supporting portion for transfer and is relatively movable with respect to the wafer supporting table in a standing direction of the wafer supporting portion for transfer.
Public/Granted literature
Information query
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