Invention Grant
- Patent Title: Binding machine
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Application No.: US16396162Application Date: 2019-04-26
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Publication No.: US11428020B2Publication Date: 2022-08-30
- Inventor: Osamu Itagaki
- Applicant: MAX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MAX CO., LTD.
- Current Assignee: MAX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2016-257452 20161229
- Main IPC: E04G21/12
- IPC: E04G21/12 ; B21F15/04 ; B65B13/28 ; B21F23/00

Abstract:
A binding machine includes a wire feeding unit configured to feed a wire to be wound on an object to be bound and a binding unit configured to twist the wire wound on the object to be bound. The wire feeding unit includes a pair of feeding members configured to sandwich the wire between the pair of feeding members and to feed the wire by a rotating operation, a wire feeding drive unit connected to one feeding member and configured to rotatively drive the one feeding member, and a load reducing part configured to reduce or remove a load, which is to be applied to the wire via the one feeding member, of the wire feeding drive unit.
Public/Granted literature
- US20190249448A1 BINDING MACHINE Public/Granted day:2019-08-15
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