Invention Grant
- Patent Title: Cooling device, control method, and storage medium related to a plurality of evaporators and a plurality of evaporator condensers
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Application No.: US16975918Application Date: 2019-03-19
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Publication No.: US11428442B2Publication Date: 2022-08-30
- Inventor: Hisato Sakuma , Koichi Todoroki , Masaki Chiba , Takafumi Natsumeda , Minoru Yoshikawa
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-055825 20180323
- International Application: PCT/JP2019/011564 WO 20190319
- International Announcement: WO2019/181972 WO 20190926
- Main IPC: F25B5/02
- IPC: F25B5/02 ; F25B6/02 ; F25B25/00 ; F25B49/02 ; H05K7/20

Abstract:
A cooling device includes a first evaporation unit, a second evaporation unit, a first condensation unit, a second condensation unit, common piping, a compressor, an expansion valve, a first valve, and a second valve. The common piping combines liquid-phase refrigerant flowing from the first condensation unit and liquid-phase refrigerant flowing from the second condensation unit. The first valve adjusts the liquid-phase refrigerant amount flowing into the first evaporation unit. The second valve adjusts the liquid-phase refrigerant amount flowing into the second evaporation unit. In addition, the pressure inside the common pipe is greater than the respective pressures inside the first evaporation unit and the second evaporation unit.
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