Invention Grant
- Patent Title: Pattern evaluation system and pattern evaluation method
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Application No.: US16853306Application Date: 2020-04-20
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Publication No.: US11428652B2Publication Date: 2022-08-30
- Inventor: Koichiro Irie , Ayumi Doi , Tianming Li
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JPJP2019-090344 20190513
- Main IPC: G01N23/2251
- IPC: G01N23/2251 ; H01J37/26

Abstract:
Provided is a technology for evaluating a property of a pattern formed inside a sample from two-dimensional information of the sample. A pattern evaluation system of the present disclosure includes a computer subsystem that executes a process of evaluating a property of a pattern by reading a program from a memory that stores the program for evaluating the property of the pattern formed inside a sample. The computer subsystem executes a process of acquiring an image of the sample; a process of extracting a signal waveform from the image; a process of calculating a feature amount in a predetermined region of the signal waveform; a process of comparing the feature amount with a reference value of the feature amount; and a process of evaluating the property of the pattern based upon a comparison result in the comparison process.
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