Invention Grant
- Patent Title: Earthquake sensing module and earthquake sensing system
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Application No.: US16344125Application Date: 2017-09-14
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Publication No.: US11428833B2Publication Date: 2022-08-30
- Inventor: Koji Terumoto , Noriyuki Jitosho
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2016-211615 20161028
- International Application: PCT/JP2017/033323 WO 20170914
- International Announcement: WO2018/079126 WO 20180503
- Main IPC: G01V1/00
- IPC: G01V1/00 ; H01R13/66 ; H01R13/713 ; H01R25/00
Abstract:
An earthquake sensing module includes an acceleration sensor configured to detect accelerations on a plurality of detection axes, a module control unit configured to control the acceleration sensor, and a module storage unit configured to store state information of the acceleration sensor.
Public/Granted literature
- US20210293981A1 EARTHQUAKE SENSING MODULE AND EARTHQUAKE SENSING SYSTEM Public/Granted day:2021-09-23
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