Invention Grant
- Patent Title: Interposer
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Application No.: US16899264Application Date: 2020-06-11
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Publication No.: US11428882B2Publication Date: 2022-08-30
- Inventor: Vivek Raghunathan , Aaron John Zilkie
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB Oxford
- Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee Address: GB Oxford
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: GB1908308 20190611
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
A silicon interposer. The silicon interposer including: a silicon layer, including one or more optical waveguides each connectable to an optical fiber; an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber; and one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.
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