Invention Grant
- Patent Title: Semiconductor devices
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Application No.: US16719274Application Date: 2019-12-18
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Publication No.: US11429477B2Publication Date: 2022-08-30
- Inventor: Hee Jin Byun
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2019-0103362 20190822
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G06F11/10 ; G06F13/16 ; G11C8/10 ; G11C7/10

Abstract:
A semiconductor device includes first and second memory regions spaced apart from each other and a fail information storage region disposed between the first and second memory regions. A parity including error information on data is stored in a first parity region of the fail information storage region while a write operation is applied to the first memory region. The parity is stored in a second parity region of the fail information storage region while the write operation is applied to the second memory region. An error of the data is corrected by the parity stored in the first parity region while a read operation is applied to the first memory region. The error of the data is corrected by the parity stored in the second parity region while the read operation is applied to the second memory region.
Public/Granted literature
- US20210055987A1 SEMICONDUCTOR DEVICES Public/Granted day:2021-02-25
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