Invention Grant
- Patent Title: Forming a lock structure in a semiconductor chip pad
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Application No.: US16931973Application Date: 2020-07-17
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Publication No.: US11430669B2Publication Date: 2022-08-30
- Inventor: Petteri Palm
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102019119521.7 20190718
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/3213 ; H01L23/00
Abstract:
A method of manufacturing a chip package is provided. The method includes patterning at least one chip pad of a chip to form a patterned structure in the at least one chip pad, the patterned structure including at least one predefined recess, and encapsulating the chip with encapsulating material, thereby filling the at least one predefined recess.
Public/Granted literature
- US20210020458A1 Chip Package and Method of Manufacturing a Chip Package Public/Granted day:2021-01-21
Information query
IPC分类:
