Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
-
Application No.: US17230120Application Date: 2021-04-14
-
Publication No.: US11430673B2Publication Date: 2022-08-30
- Inventor: Yusuke Hashimoto , Jiro Higashijima
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JPJP2020-074920 20200420
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/10 ; B08B3/08 ; G03F7/42
Abstract:
A substrate processing apparatus includes at least one nozzle unit configured to eject a processing liquid to a substrate. The at least one nozzle unit includes a conductive part for voltage application configured to be brought into contact with the processing liquid, and a voltage detection part or a current detection part configured to be brought into contact with the processing liquid. A non-conductive part is interposed between the conductive part for voltage application and the voltage detection part or between the conductive part for voltage application and the current detection part. A voltage application part is connected to the conductive part for voltage application, and a voltage detector is installed in the voltage detection part or a current detector is installed in the current detection part.
Public/Granted literature
- US20210327728A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-10-21
Information query
IPC分类:
