Invention Grant
- Patent Title: Heat treatment method of light irradiation type
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Application No.: US16901217Application Date: 2020-06-15
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Publication No.: US11430676B2Publication Date: 2022-08-30
- Inventor: Hikaru Kawarazaki , Yoshihide Nozaki
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2019-145205 20190807
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/66 ; H01L21/67

Abstract:
A semiconductor wafer is heated by a flash of light emitted from a flash lamp after being preheated by a halogen lamp. Temperature of the semiconductor wafer immediately before the flash of light is emitted is measured by a lower radiation thermometer. At the time of irradiation with a flash of light, an upper radiation thermometer measures temperature increase of a front surface of the semiconductor wafer. Front surface temperature of the semiconductor wafer is calculated by adding the temperature increase of the front surface of the semiconductor wafer at the time of irradiation with a flash of light measured by the upper radiation thermometer to the back surface temperature of the semiconductor wafer measured by the lower radiation thermometer.
Public/Granted literature
- US20210043477A1 HEAT TREATMENT METHOD OF LIGHT IRRADIATION TYPE Public/Granted day:2021-02-11
Information query
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