Invention Grant
- Patent Title: Measurement system, substrate processing system, and device manufacturing method
-
Application No.: US17323180Application Date: 2021-05-18
-
Publication No.: US11430684B2Publication Date: 2022-08-30
- Inventor: Go Ichinose , Tomonori Dosho
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2016-192810 20160930
- Main IPC: H01L21/68
- IPC: H01L21/68 ; G01B11/27 ; G03F1/42 ; G03F7/20 ; G03F7/26 ; G03F9/00 ; G01B21/00

Abstract:
A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.
Public/Granted literature
- US20210272833A1 MEASUREMENT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD Public/Granted day:2021-09-02
Information query
IPC分类: