Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and storage medium
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Application No.: US16502310Application Date: 2019-07-03
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Publication No.: US11430704B2Publication Date: 2022-08-30
- Inventor: Kanzo Kato
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP2015-136218 20150707
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L21/67 ; H01L21/02 ; H01L21/027 ; G03F7/38
Abstract:
A substrate processing apparatus, including: a development part configured to develop a substrate on which an exposed resist film formed to form a pattern on a surface of the substrate; a heat plate configured to mount and heat the substrate on which the resist film formed on the heat plate before the development is performed; a distribution acquisition part configured to optically acquire a size distribution of a dimension of the pattern on the surface of the substrate; and a determination part configured to determine whether abnormality has occurred in a mounting state of the substrate on the heat plate, based on the size distribution of the dimension of the pattern.
Public/Granted literature
- US20190326186A1 Substrate Processing Apparatus, Substrate Processing Method, and Storage Medium Public/Granted day:2019-10-24
Information query
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