Lead frames for semiconductor device packages may include lead fingers proximate to a die-attach pad. A convex corner of the die-attach pad, or of the lead fingers proximate to a geometric center of the lead frame may be rounded to exhibit a radius of curvature of at least two times a greatest thickness of the die-attach pad, the thickness measured in a direction perpendicular to a major surface of the die-attach pad. A shortest distance between the die-attach pad and a largest of the lead fingers may be at least two times the greatest thickness of the die-attach pad.