Invention Grant
- Patent Title: Barrier removal for conductor in top via integration scheme
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Application No.: US16791400Application Date: 2020-02-14
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Publication No.: US11430735B2Publication Date: 2022-08-30
- Inventor: Brent Alan Anderson , Nicholas Anthony Lanzillo , Christopher J. Penny , Lawrence A. Clevenger , Kisik Choi , Robert Robison
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Samuel A. Waldbaum
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/522 ; H01L21/768
Abstract:
A multi-layer device comprising a barrier or adhesion layer located on a portion of a first top surface of a first layer, a conductive metal layer located on barrier or adhesion layer; and a dielectric layer located on top of the first layer, wherein the dielectric layer is in direct contact with the sidewall of the conductive metal layer.
Public/Granted literature
- US20210257308A1 BARRIER REMOVAL FOR CONDUCTOR IN TOP VIA INTEGRATION SCHEME Public/Granted day:2021-08-19
Information query
IPC分类:
