Invention Grant
- Patent Title: Die-attach method to compensate for thermal expansion
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Application No.: US15673734Application Date: 2017-08-10
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Publication No.: US11430744B2Publication Date: 2022-08-30
- Inventor: David Seebacher , Christian Schuberth , Peter Singerl , Alexander Komposch
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/373 ; H01L23/00 ; H01L23/42 ; H01L23/367
Abstract:
In sonic examples, a method includes pre-stressing a flange, heating the flange to a die-attach temperature, and attaching a die to the flange at the die-attach temperature using a die-attach material. In some examples, the flange includes a metal material, the die-attach temperature may be at least two hundred degrees Celsius, and the die-attach material may include solder and/or an adhesive. In some examples, the method includes cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material.
Public/Granted literature
- US20190051617A1 DIE-ATTACH METHOD TO COMPENSATE FOR THERMAL EXPANSION Public/Granted day:2019-02-14
Information query
IPC分类:
