Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17192069Application Date: 2021-03-04
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Publication No.: US11430795B2Publication Date: 2022-08-30
- Inventor: Hyewon Kim , Eunjung Kim , Geumjung Seong , Jay-Bok Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2020-0092328 20200724
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/762

Abstract:
A semiconductor device includes a substrate including a cell region, a peripheral region, and a boundary region therebetween, a cell device isolation pattern on the cell region of the substrate to define cell active patterns, a peripheral device isolation pattern on the peripheral region of the substrate to define peripheral active patterns, and an insulating isolation pattern on the boundary region of the substrate, the insulating isolation pattern being between the cell active patterns and the peripheral active patterns, wherein a bottom surface of the insulating isolation pattern includes a first edge adjacent to a side surface of a corresponding one of the cell active patterns, and a second edge adjacent to a side surface of a corresponding one of the peripheral active patterns, the first edge being at a height lower than the second edge, when measured from a bottom surface of the substrate.
Public/Granted literature
- US20220028868A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-01-27
Information query
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