Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17197127Application Date: 2021-03-10
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Publication No.: US11430885B2Publication Date: 2022-08-30
- Inventor: Toshifumi Nishiguchi
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Allen & Overy LLP
- Priority: JPJP2020-157486 20200918
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L29/10 ; H01L29/423 ; H01L29/08 ; H01L29/739

Abstract:
According to one embodiment, a semiconductor device includes a first electrode, first and third semiconductor regions of a first conductivity type, second and fourth semiconductor regions of a second conductivity type, a gate electrode and a second electrode. The third semiconductor region is disposed on one portion of the second semiconductor region. The fourth semiconductor region is disposed on another portion of the second semiconductor region, is positioned below the third semiconductor region. The second electrode includes first and second portions separated from each other and allowing the fourth semiconductor region to be positioned therebetween, and the third portion disposed on the first and second portions and arranged with the third semiconductor region. The first, second, and third portions are in contact with the fourth semiconductor region.
Public/Granted literature
- US20220093788A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-24
Information query
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