- Patent Title: Micro light emitting diode array and manufacturing method thereof
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Application No.: US16736286Application Date: 2020-01-07
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Publication No.: US11430923B2Publication Date: 2022-08-30
- Inventor: Ching-Fuh Lin , Chun-Yu Lin , Yi-Shan Lin , Jung-Kuan Huang
- Applicant: National Taiwan University
- Applicant Address: TW Taipei
- Assignee: National Taiwan University
- Current Assignee: National Taiwan University
- Current Assignee Address: TW Taipei
- Agency: Stout, Uxa & Buyan, LLP
- Agent Donald E. Stout
- Priority: TW108127903 20190806
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50
Abstract:
An embodiment of the present invention provides a micro light emitting diode (LED) array and its manufacturing method. The micro-LED includes a substrate, an epitaxial layer formed on the substrate, and a conversion film formed on the epitaxial layer. Pixels can be defined through lithography, and the pixel size can be very small. This method is characterized in that a mass transfer is not required.
Public/Granted literature
- US20210043808A1 MICRO LIGHT EMITTING DIODE ARRAY AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-02-11
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