The invention describes a circuit assembly comprising a circuit board with a metal core, a pattern of conductive tracks, and a dielectric layer between the metal core and the conductive tracks; at least one circuit component mounted to the circuit board by means of solder interconnects, wherein a solder interconnect is formed between a contact pad of the circuit component and a conductive track; characterized in that the metal core comprises at least one cavity, wherein a cavity is arranged in the vicinity of a solder interconnect. The invention further describes a circuit board for such a circuit assembly, and a method of manufacturing such a circuit assembly.