Invention Grant
- Patent Title: Flexible substrate
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Application No.: US17258366Application Date: 2018-11-22
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Publication No.: US11431070B2Publication Date: 2022-08-30
- Inventor: Shin Chaki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2018/043238 WO 20181122
- International Announcement: WO2020/105181 WO 20200528
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02

Abstract:
A flexible substrate (1) is bent at a bending part (2). A dielectric plate (3) has first and second main surfaces opposite to each other. A high-frequency signal line (4) is provided on the first main surface of the dielectric plate (3). A ground conductor (5) is provided on the second main surface of the dielectric plate (3). The high-frequency signal line (4) and the ground conductor (5) form a micro strip line. A local absent part (6) facing the high-frequency signal line (4) is provided on the ground conductor (5) only at the bending part (2).
Public/Granted literature
- US20210296750A1 FLEXIBLE SUBSTRATE Public/Granted day:2021-09-23
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