Invention Grant
- Patent Title: Chip antenna module
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Application No.: US17192228Application Date: 2021-03-04
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Publication No.: US11431097B2Publication Date: 2022-08-30
- Inventor: Seong Hee Choi , Sang Jong Lee
- Applicant: Samsung Electro-Mechanics., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics., Ltd.
- Current Assignee: Samsung Electro-Mechanics., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0129102 20181026
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/38 ; H01Q9/04 ; H01Q1/48 ; H01Q1/24

Abstract:
A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
Public/Granted literature
- US20210194135A1 CHIP ANTENNA MODULE Public/Granted day:2021-06-24
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