- Patent Title: Chip antenna module and method of manufacturing chip antenna module
-
Application No.: US16739177Application Date: 2020-01-10
-
Publication No.: US11431107B2Publication Date: 2022-08-30
- Inventor: Ju Hyoung Park , Sung Yong An , Myeong Woo Han , Sung Nam Cho , Jae Yeong Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2019-0042634 20190411,KR10-2019-0099400 20190814
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/04 ; H01Q21/06

Abstract:
A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.
Public/Granted literature
- US20200328530A1 CHIP ANTENNA MODULE AND METHOD OF MANUFACTURING CHIP ANTENNA MODULE Public/Granted day:2020-10-15
Information query