Invention Grant
- Patent Title: Connectors for interconnecting microelectronic circuits
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Application No.: US17147225Application Date: 2021-01-12
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Publication No.: US11431115B2Publication Date: 2022-08-30
- Inventor: Thomas H. Di Stefano , Peter T. Di Stefano
- Applicant: Centipede Systems, Inc.
- Applicant Address: US CA San Jose
- Assignee: Centipede Systems, Inc.
- Current Assignee: Centipede Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agent Michael B. Einschlag
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/52 ; H01L23/00 ; H01R12/71

Abstract:
A connector includes a metal cylinder with three or more slots cut from a first end and three or more slots cut from a second end which are intercalated between the slots from the first end, whereby the connector is radially compressible along its entire length. The connector is adapted for insertion at one end into a hole in a circuit board, thereby making electrical contact to traces in the circuit board.
Public/Granted literature
- US20210257758A1 Connectors for Interconnecting Microelectronic Circuits Public/Granted day:2021-08-19
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