A wire management device for mounting to a structure that has a mounting surface with an edge includes a planar portion having opposing side edges, a front face and a rear face that is configured for engaging the mounting surface. A wire management structure is coupled to extend from the front face and is configured for capturing elongated wires to secure a portion of the wires with the wire management device. An alignment structure is positioned proximate at least one side edge of the planar portion. The alignment structure is configured for engaging an edge of the mounting surface to align the side edges of the planar portion with respect to the mounting surface edges for centering the device. Once the wire management device is mounted, the alignment structure is breakable from the planar portion for being separated and discarded. Then a cover is clipped onto the wire management structure.