Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US17322909Application Date: 2021-05-18
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Publication No.: US11431360B2Publication Date: 2022-08-30
- Inventor: Tomoya Oda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2020-102273 20200612
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F3/24 ; H01Q1/22 ; H05K1/02 ; H05K1/11

Abstract:
A module substrate has first and second main surfaces that on opposite sides of the module substrate, a resin member that covers the second main surface, and a plurality of post electrodes that are spaced apart from each other on the second main surface and penetrate through the resin member from the second main surface. The plurality of post electrodes includes a first post electrode and a first recess recessed toward the second main surface and formed in at least part of a region of the surface of the resin member that surrounds a leading end part of the first post electrode.
Public/Granted literature
- US20210391878A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-12-16
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