Invention Grant
- Patent Title: Radio frequency module and communication device
-
Application No.: US17207756Application Date: 2021-03-22
-
Publication No.: US11431365B2Publication Date: 2022-08-30
- Inventor: Yukiya Yamaguchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2020-057993 20200327
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/04

Abstract:
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier configured to amplify a transmission signal in a first frequency band; a second power amplifier configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a switch having a first pole connected to an input terminal of the first power amplifier and a second pole connected to an input terminal of the second power amplifier. The first power amplifier and the second power amplifier are disposed on the first principal surface, and the switch is disposed on the second principal surface.
Public/Granted literature
- US20210306019A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-09-30
Information query