Invention Grant
- Patent Title: Circuit board including conductive structure for electrically connecting wires, and electronic device including same
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Application No.: US16977617Application Date: 2019-03-08
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Publication No.: US11431830B2Publication Date: 2022-08-30
- Inventor: Junghoon Park , Dongyup Lee , Hyunseok Kim , Yongseung Yi , Hoyeong Lim , Seunggoo Kang , Dongil Son , Hyangbok Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR10-2018-0027309 20180308
- International Application: PCT/KR2019/002751 WO 20190308
- International Announcement: WO2019/172719 WO 20190912
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H01L23/552 ; H01L23/498 ; H01L23/31 ; H04M1/02 ; G06F1/16 ; H05K1/02
Abstract:
Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.
Public/Granted literature
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