A two-phase cooling apparatus for an information handling system, including a container holding dielectric fluid, the dielectric fluid having a vapor-fluid boundary within the container, the container further containing a printed circuit board (PCB) including computing components, with the dielectric fluid surrounding the PCB and the computing components, the dielectric fluid decreasing a temperature of the PCB by removing heat from the PCB in the form of vaporization; a pump positioned within the container, the pump capturing a portion of vapor of the dielectric fluid, at the vapor-fluid boundary, that results from the vaporization of the dielectric fluid; and a diffuser positioned within the container and coupled to the pump to introduce the captured vapor into the dielectric fluid.