A vibration assisted wire machining device is provided, the vibration assisted wire machining device allows a metal wire to be driven by a bi-axial sinusoidal vibration source during a wire machining process, wherein the bi-axial sinusoidal waveforms have the same amplitude, and preferably, the bi-axial sinusoidal waveforms are synchronous and always have a vibration phase difference of 90 degrees. Therefore, the present invention can reduce wire breakage risks and improve wire-cutting efficiency, and raise machining stability and material removal rate of a wire-electrical discharge machining (Wire-EDM) process performed on a workpiece, as well as achieve desirable precision of a geometric shape. It also relates to a vibration assisted wire machining device that enables metal wires associated with the abrasive slurry formed of hard abrasive grains, for performing bi-axial vibration assisted abrasive cutting or abrasive grinding on the workpiece.