Invention Grant
- Patent Title: Computer chassis welding device
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Application No.: US16504527Application Date: 2019-07-08
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Publication No.: US11433472B2Publication Date: 2022-09-06
- Inventor: Chung Chai , Yu-Ming Xiao , Lin Ding , Zhi-Bing Li
- Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Wuhan; TW New Taipei
- Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Wuhan; TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201811152612.7 20180929
- Main IPC: B23K9/00
- IPC: B23K9/00 ; B23K11/11 ; B23K37/04 ; B23K37/02 ; B23P19/00 ; B25J15/06 ; B23K9/007

Abstract:
A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.
Public/Granted literature
- US1651065A Method of exhausting thermionic tubes and like devices Public/Granted day:1927-11-29
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