Invention Grant
- Patent Title: Ultrasonic machining device, method for configuring an ultrasonic machining device, and system having an ultrasonic machining device of this type
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Application No.: US16765892Application Date: 2017-11-29
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Publication No.: US11433475B2Publication Date: 2022-09-06
- Inventor: Mustafa Ayabakan
- Applicant: TELSONIC HOLDING AG
- Applicant Address: CH Bronschhofen
- Assignee: TELSONIC HOLDING AG
- Current Assignee: TELSONIC HOLDING AG
- Current Assignee Address: CH Bronschhofen
- Agency: Finch & Maloney PLLC
- Agent Jay S. Franklin; Michael J. Bujold
- International Application: PCT/EP2017/080780 WO 20171129
- International Announcement: WO2019/105539 WO 20190606
- Main IPC: B23K20/10
- IPC: B23K20/10 ; B23K31/12 ; B26D7/08 ; G06K19/06 ; G06K19/07 ; G06K19/077

Abstract:
An ultrasonic machining device (1) for machining a workpiece. At least one component, selected from the group including a generator (11), a converter (12), a booster (13), a sonotrode (14), a HV cable (15), a machine frame (16) and a receiving device for the workpiece (17), is/are assigned an identifier (18). The identifier (18) characterizes at least one individual parameter of the component. The device (1) is assigned an input interface (19) which reads in the identifier (18) or generated data from the identifier. The device (1) is assigned a data processing arrangement (20). By way of the data processing arrangement (20), based on the read-in identifier (18) or the data generated from the identifier (18), at least one parameter of the device (1) is determined in such a way that the device (1) is operated in a target operating state, e.g., a resonant vibrating state.
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