Invention Grant
- Patent Title: Polishing table and polishing apparatus having ihe same
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Application No.: US15996988Application Date: 2018-06-04
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Publication No.: US11433502B2Publication Date: 2022-09-06
- Inventor: Kenichiro Saito , Ryuichi Kosuge
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-111605 20170606
- Main IPC: B24B37/22
- IPC: B24B37/22 ; B24D3/32 ; B24B37/24 ; B24B37/16 ; B24B55/02 ; B24B37/10 ; B24B45/00 ; B24B37/34 ; B24B41/047 ; B24B37/04

Abstract:
An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.
Public/Granted literature
- US20180345447A1 POLISHING TABLE AND POLISHING APPARATUS HAVING THE SAME Public/Granted day:2018-12-06
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