Invention Grant
- Patent Title: Movable mold insert adjuster
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Application No.: US16772309Application Date: 2019-02-06
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Publication No.: US11433571B2Publication Date: 2022-09-06
- Inventor: Chien-Hua Chen , Jimmy Perez
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US CO Fort Collins
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US CO Fort Collins
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/016838 WO 20190206
- International Announcement: WO2020/162925 WO 20200813
- Main IPC: B29C33/30
- IPC: B29C33/30 ; B41J2/14 ; B29C33/00 ; B29C33/14 ; B29C33/42 ; B29C39/10 ; B29K63/00 ; B29L31/00
Abstract:
A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.
Public/Granted literature
- US20210221029A1 MOVABLE MOLD INSERT ADJUSTER Public/Granted day:2021-07-22
Information query
