Invention Grant
- Patent Title: Method for producing polyamide-imide film
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Application No.: US16480853Application Date: 2018-02-06
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Publication No.: US11433573B2Publication Date: 2022-09-06
- Inventor: Dae Seong Oh , Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dong Jin Lim , Cheol Ho Kim
- Applicant: SKC CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SKC CO., LTD.
- Current Assignee: SKC CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0017550 20170208,KR10-2017-0026575 20170228
- International Application: PCT/KR2018/001533 WO 20180206
- International Announcement: WO2018/147611 WO 20180816
- Main IPC: B29C39/00
- IPC: B29C39/00 ; B29C48/00 ; B29C39/44 ; C08G73/10 ; C08G73/14 ; C08L79/08 ; B29K79/00

Abstract:
An embodiment can provide a method for producing a polyamide-imide film which is colorless and transparent and has excellent mechanical properties, the method comprising: a step of producing a polyamide-imide polymer solution by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound; a step of producing a gel sheet by extruding, casting and drying the polymer solution; and a step of producing a polyamide-imide film by heat-treating the gel sheet, wherein the viscosity of the polymer solution is 100,000 to 500,000 cps, and the polyamide-imide film has a yellowness index of 5 or lower, a haze of 2% or lower, a transmittance of 85% or above and a modulus of 5.0 GPa or above, at a thickness of 20 μm to 75 μm.
Public/Granted literature
- US20190389095A1 METHOD FOR PRODUCING POLYAMIDE-IMIDE FILM Public/Granted day:2019-12-26
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