Invention Grant
- Patent Title: Method of layerwise fabrication of a three-dimensional object
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Application No.: US16801220Application Date: 2020-02-26
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Publication No.: US11433597B2Publication Date: 2022-09-06
- Inventor: Diana Ravich , Ophira Melamed , Avraham Teken , Gavish Mida , Avraham Levy , Cesar M. Manna
- Applicant: Stratasys Ltd.
- Applicant Address: IL Rehovot
- Assignee: Stratasys Ltd.
- Current Assignee: Stratasys Ltd.
- Current Assignee Address: IL Rehovot
- Main IPC: B29C64/112
- IPC: B29C64/112 ; B33Y10/00 ; C09D11/101 ; B33Y70/00 ; B29C64/295 ; B29C64/106 ; B29C64/291 ; B29C35/08 ; C09D11/107 ; C09D11/30 ; B33Y80/00 ; B29K33/00 ; B29K105/00 ; B29L9/00

Abstract:
A method of layerwise fabrication of a three-dimensional object is disclosed. The method comprises, for each of at least a few of the layers: dispensing at least a first modeling formulation and a second modeling formulation to form a core region using both the first and the second modeling formulations, and at least one envelope region at least partially surrounding the core region using one of the first and the second modeling formulations but not the other one of the first and the second modeling formulations. The method can also comprise exposing the layer to curing energy. The first modeling formulation is characterized, when hardened, by heat deflection temperature (HDT) of at least 90° C., and the second modeling formulation is characterized, when hardened, by Izod impact resistance (IR) value of at least 45 J/m.
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