Invention Grant
- Patent Title: Multilayered dielectric composites for high temperature applications
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Application No.: US16320919Application Date: 2017-07-25
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Publication No.: US11433648B2Publication Date: 2022-09-06
- Inventor: Qing Wang , Qi Li
- Applicant: The Penn State Research Foundation
- Applicant Address: US PA University Park
- Assignee: The Penn State Research Foundation
- Current Assignee: The Penn State Research Foundation
- Current Assignee Address: US PA University Park
- Agency: Fish & Richardson P.C.
- International Application: PCT/US2017/043618 WO 20170725
- International Announcement: WO2018/052532 WO 20180322
- Main IPC: B32B17/10
- IPC: B32B17/10 ; C08K3/20 ; C08K3/28 ; C08K3/38 ; C08L83/14 ; H01G4/12 ; H01G4/14 ; H01G4/20
Abstract:
The present document relates to multilayered dielectric composites for high-temperature applications and related methods.
Public/Granted literature
- US20210280371A1 MULTILAYERED DIELECTRIC COMPOSITES FOR HIGH TEMPERATURE APPLICATIONS Public/Granted day:2021-09-09
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