Invention Grant
- Patent Title: Fluid-filled pressure sensor assembly capable of higher pressure environments
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Application No.: US14533662Application Date: 2014-11-05
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Publication No.: US11433654B2Publication Date: 2022-09-06
- Inventor: Robert Gardner , Louis DeRosa , Richard Martin
- Applicant: Kulite Semiconductor Products, Inc.
- Applicant Address: US NJ Leonia
- Assignee: Kulite Semiconductor Products, Inc.
- Current Assignee: Kulite Semiconductor Products, Inc.
- Current Assignee Address: US NJ Leonia
- Agency: Troutman Pepper Hamilton Sanders LLP
- Agent James E. Schutz; Christopher C. Close, Jr.
- Main IPC: G01L19/06
- IPC: G01L19/06 ; G01L19/00 ; B32B37/00 ; B32B37/18 ; G01L9/00 ; G01L13/00

Abstract:
This disclosure provides systems and methods for a fluid-filled pressure sensor assembly for higher pressure environments. A fluid-filled pressure sensor assembly may be adapted for coupling to a structure at a mating surface and may include a header; a pressure sensor coupled to the header; a diaphragm coupled to the header and configured for positioning forward of the mating surface so that a fluid region is disposed between the diaphragm and the pressure sensor; a fill hole coupled to the fluid region; a sealing element coupled to the fill hole and configured for positioning forward of the mating surface; and wherein during operation the first pressure applied at the diaphragm is substantially transferred by the fluid in the fluid region and the fill hole to an inner-side of the sealing element and the first pressure is about equivalent to a second pressure applied at an outer-side of the sealing element.
Public/Granted literature
- US20160123826A1 FLUID-FILLED PRESSURE SENSOR ASSEMBLY CAPABLE OF HIGHER PRESSURE ENVIRONMENTS Public/Granted day:2016-05-05
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