Invention Grant
- Patent Title: Methods for manufacturing micromechanical components and method for manufacturing a mould insert component
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Application No.: US17178032Application Date: 2021-02-17
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Publication No.: US11434131B2Publication Date: 2022-09-06
- Inventor: Nicolas Blondiaux , Raphaël Pugin
- Applicant: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et Développement
- Applicant Address: CH Neuchâtel
- Assignee: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et Développement
- Current Assignee: CSEM Centre Suisse d'Electronique et de Microtechnique SA—Recherche et Développement
- Current Assignee Address: CH Neuchâtel
- Agency: Duane Morris LLP
- Agent Gregory M. Lefkowitz; Randall C. Pyles
- Priority: EP18175930 20180605
- Main IPC: B81C99/00
- IPC: B81C99/00 ; B81C1/00 ; B81B5/00 ; B82Y40/00
Abstract:
Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.
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