Invention Grant
- Patent Title: Polyamide-imide film and method for producing same
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Application No.: US16477664Application Date: 2018-02-06
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Publication No.: US11434335B2Publication Date: 2022-09-06
- Inventor: Dae Seong Oh , Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dong Jin Lim , Kyungeun Oh
- Applicant: SKC CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SKC CO., LTD.
- Current Assignee: SKC CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0017550 20170208,KR10-2017-0122035 20170921
- International Application: PCT/KR2018/001567 WO 20180206
- International Announcement: WO2018/147617 WO 20180816
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C08J5/18 ; B29C39/24 ; B29C39/38 ; B29C39/42 ; B29C39/44 ; C08G73/10 ; C08L79/08 ; B29C41/00 ; B29K77/00 ; B29K105/00

Abstract:
An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.
Information query
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