Invention Grant
- Patent Title: Resin sheet and adhesive-layer-having resin sheet
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Application No.: US16638340Application Date: 2018-08-07
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Publication No.: US11434341B2Publication Date: 2022-09-06
- Inventor: Yusuke Yamanari , Makoto Saito , Akira Hirao , Kenji Furuta
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-163083 20170828,JP2018-143561 20180731
- International Application: PCT/JP2018/029569 WO 20180807
- International Announcement: WO2019/044422 WO 20190307
- Main IPC: C08J9/00
- IPC: C08J9/00 ; C09J7/38 ; C09J7/26 ; C08J9/10 ; C08J9/12 ; C09J11/04

Abstract:
A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.
Public/Granted literature
- US20200224000A1 RESIN SHEET AND ADHESIVE-LAYER-HAVING RESIN SHEET Public/Granted day:2020-07-16
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