Invention Grant
- Patent Title: Resin composition, resin cured product and resin substrate
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Application No.: US16978260Application Date: 2019-03-04
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Publication No.: US11434359B2Publication Date: 2022-09-06
- Inventor: Takashi Inagaki , Junpei Hayama
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-041990 20180308
- International Application: PCT/JP2019/008326 WO 20190304
- International Announcement: WO2019/172169 WO 20190912
- Main IPC: C08L33/14
- IPC: C08L33/14 ; B32B27/08 ; B32B27/18 ; B32B27/38

Abstract:
A resin composition including: a thermosetting resin component including a mesogen; and a phosphorus atom-containing thermoplastic polymer type frame retardant, wherein the thermoplastic polymer type frame retardant is a phosphorous atom-containing formed by polymerizing or copolymerizing one of monomers represented by general formulae (1) and (2) below, wherein, in the general formulae (1) and (2), each of R1 and R2 is any one of an alkyl group, an alkoxy group, an aryl group and an aryloxy group, R1 and R2 being different or identical, and R3 is a methyl group or a hydrogen atom.
Public/Granted literature
- US11505694B2 Resin composition, resin cured product and resin substrate Public/Granted day:2022-11-22
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