Invention Grant
- Patent Title: Adhesive film and adhesive substrate
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Application No.: US16468355Application Date: 2017-12-14
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Publication No.: US11434393B2Publication Date: 2022-09-06
- Inventor: Yongsuk Yang , Kyosung Hwang , Gyu Jin Jung
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Daniel J. Iden
- Priority: KR10-2016-0171410 20161215
- International Application: PCT/IB2017/057947 WO 20171214
- International Announcement: WO2018/109711 WO 20180621
- Main IPC: C09J7/10
- IPC: C09J7/10 ; C09J7/40 ; C09J133/12 ; C09J133/06 ; C09J133/08 ; C08K3/04 ; C08K3/22 ; C08K3/36 ; C09J133/10

Abstract:
The present invention relates to an adhesive film including a photothermal conversion layer including a light absorber and a thermally decomposable resin; and an adhesive layer, in which the thermally decomposable resin has a —COOH or —OH functional group and includes two kinds of acrylic resins having different weight average molecular weights, and an adhesive substrate including the adhesive film and a substrate to be processed. In the adhesive film and the adhesive substrate according to the present invention, it is possible to simplify a processing process of the substrate and reduce costs and time, and prevent damage to a substrate and a circuit or an element formed on the substrate.
Public/Granted literature
- US20200010735A1 ADHESIVE FILM AND ADHESIVE SUBSTRATE Public/Granted day:2020-01-09
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