Invention Grant
- Patent Title: Adhesive having increased bonding strength
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Application No.: US15931637Application Date: 2020-05-14
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Publication No.: US11434394B2Publication Date: 2022-09-06
- Inventor: Fung Ling Yap , Chang Sheng Lee , Siew Ling Chong , Zhan Cheng
- Applicant: The Procter & Gamble Company , Agency for Science, Technology & Research
- Applicant Address: US OH Cincinnati; SG Singapore
- Assignee: The Procter & Gamble Company,Agency for Science, Technology & Research
- Current Assignee: The Procter & Gamble Company,Agency for Science, Technology & Research
- Current Assignee Address: US OH Cincinnati; SG Singapore
- Agent Steven Robert Chuey; Sarah M DeCristofaro
- Main IPC: C09J7/30
- IPC: C09J7/30 ; C09J7/28
Abstract:
Articles having a thermal imprinted adhesive on a substrate of a plurality of certain conicals have improved bonding strength.
Public/Granted literature
- US20200270482A1 ADHESIVE HAVING INCREASED BONDING STRENGTH Public/Granted day:2020-08-27
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