Invention Grant
- Patent Title: Hard material layer on metal substrate
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Application No.: US16970165Application Date: 2019-02-14
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Publication No.: US11434571B2Publication Date: 2022-09-06
- Inventor: Bernd Watzinger , Matija Burger
- Applicant: IWIS Motorsysteme GmbH & Co. KG
- Applicant Address: DE Munich
- Assignee: IWIS Motorsysteme GmbH & Co. KG
- Current Assignee: IWIS Motorsysteme GmbH & Co. KG
- Current Assignee Address: DE Munich
- Agency: Henry M. Feiereisen LLC
- Priority: DE102018103323.0 20180214
- International Application: PCT/EP2019/053749 WO 20190214
- International Announcement: WO2019/158670 WO 20190822
- Main IPC: C23C16/34
- IPC: C23C16/34 ; C23C28/04 ; C23C30/00 ; F16G13/18 ; C23C24/00
Abstract:
A chain component of a chain for transmitting a force includes a steel-based substrate and a hard material layer on an external side of the steel-based substrate. The hard material layer contains metal nitrides and the metal carbide content in the hard material layer decreases toward the external side of the hard material layer.
Public/Granted literature
- US20210102297A1 HARD MATERIAL LAYER ON METAL SUBSTRATE Public/Granted day:2021-04-08
Information query
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