Invention Grant
- Patent Title: Waterproof manifold electromagnetic valve
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Application No.: US16485951Application Date: 2018-02-06
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Publication No.: US11434939B2Publication Date: 2022-09-06
- Inventor: Shinji Miyazoe , Toru Fujiwara , Takashi Murakami
- Applicant: SMC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: SMC CORPORATION
- Current Assignee: SMC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2017-031324 20170222
- International Application: PCT/JP2018/003890 WO 20180206
- International Announcement: WO2018/155153 WO 20180830
- Main IPC: F15B13/08
- IPC: F15B13/08 ; F16K27/04 ; F15B20/00 ; F16K31/06

Abstract:
A manifold includes multiple first valve mount portions, on each of which three electromagnetic valves are arranged side by side, or a plurality of second valve mount portions, on each of which two electromagnetic valves are arranged side by side, or includes at least one of the first valve mount portions and at least one of the second valve mount portions. Waterproof covers are attached to the valve mount portions of the manifold to each cover the three or two electromagnetic valves mounted on the valve mount portion. Thus, a waterproof manifold electromagnetic valve is formed.
Public/Granted literature
- US20200049169A1 WATERPROOF MANIFOLD ELECTROMAGNETIC VALVE Public/Granted day:2020-02-13
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