An apparatus includes a first planar region having a first surface configured to contact a heat sink. The apparatus also includes at least one second planar region having a second surface configured to contact a surface of at least one heat generating component, the at least one second planar region being parallel to the first planar region and disposed in at least one plane that is offset from the first planar region. The apparatus further includes a plurality of flexure regions disposed at an angle or curved relative to the first planar region and the at least one second planar region. The plurality of flexure regions connect the at least one second planar region to the first planar region. The first planar region and the at least one second planar region are formed of at least a thermally conductive material and a stiffening material and the plurality of flexure regions are formed of at least the stiffening material.