Invention Grant
- Patent Title: Sensor element and packaged body
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Application No.: US16555349Application Date: 2019-08-29
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Publication No.: US11435295B2Publication Date: 2022-09-06
- Inventor: Koichi Taniguchi , Mitsuhiro Iga
- Applicant: Yokogawa Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Yokogawa Electric Corporation
- Current Assignee: Yokogawa Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2018-165871 20180905
- Main IPC: G01N21/80
- IPC: G01N21/80 ; G01N21/47 ; G01N21/55 ; G01N33/24 ; G01N21/64 ; G01K11/12 ; G01N21/59 ; G01N21/81 ; G01N21/78 ; G01N21/17 ; G01N21/77 ; A01G25/16 ; G01D11/24 ; A01B79/00

Abstract:
A sensor element is used to collect environment information on a surface of the earth or a surface layer of the earth by being scattered in a target region where the environment information is collected. At least one of reflection properties, transmission properties, absorption properties, or luminescence properties with respective to an electromagnetic wave with a specific wavelength, or light emitting properties changes in accordance with an environment.
Public/Granted literature
- US20200072757A1 SENSOR ELEMENT AND PACKAGED BODY Public/Granted day:2020-03-05
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