Invention Grant
- Patent Title: Hybrid EO polymer modulator with silicon photonics
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Application No.: US17121118Application Date: 2020-12-14
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Publication No.: US11435604B2Publication Date: 2022-09-06
- Inventor: Michael Lebby , Zhiming Liu , Baoquan Chen
- Applicant: Lightwave Logic Inc.
- Applicant Address: US CO Englewood
- Assignee: Lightwave Logic Inc.
- Current Assignee: Lightwave Logic Inc.
- Current Assignee Address: US CO Englewood
- Agency: Parsons & Goltry
- Agent Robert A. Parsons; Michael W. Goltry
- Main IPC: G02F1/065
- IPC: G02F1/065 ; G02F1/035

Abstract:
An EO polymer modulator including a substrate with a cladding layer formed on a surface and a passive waveguide core, having a cross-sectional area, formed in the cladding layer and including an elongated tapered active section. An elongated trench in the cladding layer, the elongated tapered active section of the waveguide core positioned in the elongated trench, electrodes positioned on a surface of the cladding layer on opposite sides of the elongated trench, and an elongated strip of EO polymer overlying the elongated tapered active section of the waveguide core. The elongated strip of EO polymer positioned between and parallel with the electrodes and coplanar with the electrodes.
Public/Granted literature
- US20220187637A1 HYBRID EO POLYMER MODULATOR WITH SILICON PHOTONICS Public/Granted day:2022-06-16
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